The global wafer backgrinding tape market size is expected to reach $261.4 million by 2026, growing at a CAGR of 4.9% from 2019 to 2026. Wafer backgrinding is an integrated process in the fabrication of semiconductor devices. Prior to the process of backgrinding, wafers are laminated by different type of backgrinding tapes to avoid surface damage in the process of backgrinding and also protect from the wafer surface contamination caused by infiltration of grinding fluid.
Minimization of various semiconductor components requires the use of wafer backgrinding significantly. Therefore, with technological advancement and usage of more compact & portable devices, backgrinding has become crucial stage of wafer designing & integration. Thus, importance of wafer backgrinding in the fabrication of semiconductor requires wafer backgrinding tape for protecting wafer’s surface, which in turn fuels the market growth.
Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.
The factors such as increase in demand for ultra-thin wafers, rise in need for wafer fabrication, increase in focus toward wafer surface protection during grinding process, and growth in the semiconductor industry boost the growth of the wafer backgrinding tape market globally. However, increase in shift from non-UV to UV curable backgrinding tapes that increase the overall cost of wafer manufacturing is expected to hamper the market growth. Furthermore, increase in investment in wafer fabrication equipment and materials, especially in Korea and China, is expected to offer lucrative opportunities for the market expansion.
The global wafer backgrinding tape market is segmented on the basis of type, wafer size, and region. Based on type, the market is bifurcated into UV curable and non-UV tape types. Based on wafer size, the market is divided into 6-inch, 8-inch, 12-inch, and others. Based on region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd.
These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.
KEY BENEFITS FOR STAKEHOLDERS
• This study includes the analytical depiction of the global wafer back grinding market along with the current trends and future estimations to determine the imminent investment pockets.
• The report presents information regarding the key drivers, restraints, and opportunities.
• The current market is quantitatively analyzed from 2018 to 2026 to highlight the financial competency of the industry.
• Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.
GLOBAL WAFER BACKGRINDING TAPE MARKET SEGMENTATION
BY TYPE:
• UV Curable
• Non-UV
BY WAFER SIZE:
• 6-Inch
• 8-Inch
• 12-Inch
• Others
BY REGION
• North America
o U.S.
o Canada
o Mexico
• Europe
o UK
o Germany
o France
o Russia
o Rest of Europe
• Asia-Pacific
o China
o Japan
o Taiwan
o South Korea
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East & Africa
CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market share analysis (2018)
3.5. Market dynamics
3.5.1. Drivers
3.5.1.1. Increase in demand for ultra-thin wafers
3.5.1.2. Rise in need for wafer fabrication
3.5.1.3. Increase in focus toward wafer surface protection during grinding process
3.5.1.4. Growth in the semiconductor industry
3.5.2. Restraint
3.5.2.1. Increase in cost of wafer manufacturing
3.5.3. Opportunities
3.5.3.1. Increase in investment in wafer fabrication equipment and materials
3.6. Wafer manufacturing overview
3.7. Wafer fabrication
3.7.1. Types of wafer fabrication process
3.7.1.1. Front-end process
3.7.1.2. Back-end process
3.7.2. Processes involved during wafer fabrication
3.7.2.1. Oxidation
3.7.2.2. Lithography
3.7.2.3. Deposition
3.7.2.4. Etching
3.7.2.5. Chemical Mechanical Planarization
3.7.2.6. Ion implementation
3.7.2.7. Assembly and testing
3.7.2.8. Diffusion
3.7.3. Wafer grinding process (wafer thinning)
3.7.4. Type of wafer thinning
3.7.4.1. Conventional grinding
3.7.4.2. CMP
3.7.5. Machines and components required during wafer backgrinding
3.8. Backgrinding tapes customer applications and usage
3.8.1. Customer applications of backgrinding tape
3.8.2. Usage of backgrinding tape
3.9. Technology trends
3.9.1. Materials used in tapes
3.9.2. Technologies used to reduce the cycle time of backgrinding process
3.9.3. Upgrades in tape manufacturing machines
CHAPTER 4: WAFER BACKGRINDING TAPE MARKET, BY TYPE
4.1. Overview
4.2. UV Curable
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Non-UV
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
CHAPTER 5: WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE
5.1. Overview
5.2. 6-Inch
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. 8-Inch
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. 12-Inch
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Others
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
CHAPTER 6: WAFER BACKGRINDING TAPE MARKET, BY REGION
6.1. Overview
6.2. North America
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by type
6.2.3. Market size and forecast, by wafer size
6.2.4. Market analysis, by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by type
6.2.4.1.2. Market size and forecast, by wafer size
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by type
6.2.4.2.2. Market size and forecast, by wafer size
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by type
6.2.4.3.2. Market size and forecast, by wafer size
6.3. Europe
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by type
6.3.3. Market size and forecast, by wafer size
6.3.4. Market analysis, by country
6.3.4.1. U.K.
6.3.4.1.1. Market size and forecast, by type
6.3.4.1.2. Market size and forecast, by wafer size
6.3.4.2. Germany
6.3.4.2.1. Market size and forecast, by type
6.3.4.2.2. Market size and forecast, by wafer size
6.3.4.3. France
6.3.4.3.1. Market size and forecast, by type
6.3.4.3.2. Market size and forecast, by wafer size
6.3.4.4. Russia
6.3.4.4.1. Market size and forecast, by type
6.3.4.4.2. Market size and forecast, by wafer size
6.3.4.5. Rest of Europe
6.3.4.5.1. Market size and forecast, by type
6.3.4.5.2. Market size and forecast, by wafer size
6.4. Asia-Pacific
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by type
6.4.3. Market size and forecast, by wafer size
6.4.4. Market analysis, by country
6.4.4.1. China
6.4.4.1.1. Market size and forecast, by type
6.4.4.1.2. Market size and forecast, by wafer size
6.4.4.2. Japan
6.4.4.2.1. Market size and forecast, by type
6.4.4.2.2. Market size and forecast, by wafer size
6.4.4.3. Taiwan
6.4.4.3.1. Market size and forecast, by type
6.4.4.3.2. Market size and forecast, by wafer size
6.4.4.4. South Korea
6.4.4.4.1. Market size and forecast, by type
6.4.4.4.2. Market size and forecast, by wafer size
6.4.4.5. Rest of Asia-Pacific
6.4.4.5.1. Market size and forecast, by type
6.4.4.5.2. Market size and forecast, by wafer size
6.5. LAMEA
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by type
6.5.3. Market size and forecast, by wafer size
6.5.4. Market analysis, by country
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by type
6.5.4.1.2. Market size and forecast, by wafer size
6.5.4.2. Middle East & Africa
6.5.4.2.1. Market size and forecast, by type
6.5.4.2.2. Market size and forecast, by wafer size
CHAPTER 7: COMPANY PROFILES
7.1. AI TECHNOLOGY, INC.
7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Product portfolio
7.2. AMC CO., LTD
7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Product portfolio
7.3. DENKA COMPANY LIMITED
7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance
7.4. FURUKAWA ELECTRIC CO., LTD.
7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments
7.5. FORCE-ONE APPLIED MATERIALS
7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio
7.6. LINTEC OF AMERICA, INC (LINTEC CORPORATION)
7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments
7.7. MITSUI CHEMICALS, INC.
7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.8. NITTO DENKO CORPORATION
7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance
7.9. PANTECH TAPE CO., LTD.
7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Product portfolio
7.10. MINITRON ELEKTRONIK GMBH
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
