The global market for photonic integrated circuits reached $426 million in 2016. This market is expected to increase from $539 million in 2017 to $1.8 billion in 2022 at a compound annual growth rate (CAGR) of 27.5% for 2017-2022.
The market for photonic integrated circuits is segmented into the following categories:
- Integration: Monolithic integration, hybrid integration and module integration.
- Applications: Optical communications, optical signal processing, sensing and biophotonics.
- Components: Modulators, lasers, detectors, multiplexers/demultiplexers, attenuators and optical amplifiers.
- Materials: Indium phosphide (InP), gallium arsenide (GaAs), lithium niobate (LiNbO3), silicon (Si), silica-on-silicon and others.
- Geography: North America is segmented into the U.S., Canada and Mexico; Europe is segmented into France, Italy, Germany, U.K., Russia and the CIS; APAC is segmented into China, Japan, Taiwan, South Korea and others, and the RoW covers the Middle East and South America.
- Industry and competitive analysis.
- Patent analysis.
- Company profiles
- An overview of the global market for photonic integrated circuit (IC) technology.
- Analyses of global market trends, with data from 2016, estimated for 2017 and projections of compound annual growth rates (CAGRs) through 2022.
- In-depth breakdown and analysis of the photonic integrated circuit market by application, by components, and by materials.
- Definition of the market by supply chain, value chain, and future outlook and expectations.
- Comprehensive profiles of leading companies in the industry.
A photonic integrated circuit (PIC) is similar to an electronic IC. While the latter integrates many capacitors, transistors and resistors, a PIC integrates multiple optical components such as modulators, lasers, detectors, multiplexers and demultiplexers, attenuators and optical amplifiers. Large-scale PICs, similar to their large-scale electronic counterparts, increase the scope of integration due to dozens of distinct optical components that are integrated into a single device.
Traditional electric networks consist of a collection of electronic switches (with various electric components) interconnected through a mesh of optical fiber links over local, metropolitan or wide area networks (WANs). To accommodate the increasing demand for bandwidth and flexibility, these networks are constantly being modified by adding more switches and fibers, increasing the bit rate per fiber and upgrading the size and functionality of the switches.
Such increased mesh eventually leads to complex and large networks that are expensive and difficult to install, operate and maintain. Recent emerging trends and advances in optical technology promise a revolutionary all-optical network leading to improved economy, flexibility and strength by making use of the already available large existing fiber base.
While the industry faces the challenge of high initial investment, application in various products ranging from the low frequency range to the high frequency range is increasing daily. At present, PICs are successfully being integrated into small devices such as mobile devices and radios, and they are expected to be used in high-end RF and sensing operations in the near future.
Table of Contents
Chapter 1: Introduction ..1
Study Goals and Objectives.. 1
Reasons for Doing This Study ..1
Scope of Report .. 2
Information Sources .. 2
Methodology .. 2
Intended Audience .. 3
Geographic Breakdown .. 4
Analyst's Credentials .. 9
Related BCC Research Reports .. 9
Chapter 2: Summary and Highlights .. 11
Chapter 3: Market and Technology Background .. 14
Market Definition .. 14
Roadmap of Photonic Integrated Circuits .. 14
Current Trends and Outlook .. 15
Demand for High Speed Data Transfer Reduced Power Consumption and High Efficiency of Photonic Integrated Circuits .. 16
Next Generation System Integration Using Silicon Photonics .. 17
Connectivity Issue of Photonic Integrated Circuits .. 18
Key Highlights by Major Market Participants .. 19
Chapter 4: Market Breakdown by Type of Component .. 21
Laser (Optical Laser) .. 22
Modulators .. 24
Detectors .. 26
Attenuators .. 28
Multiplexer/Demultiplexer (MUX/DEMUX) .. 30
Optical Amplifiers .. 32
Chapter 5: Market Breakdown by Type of Integration .. 36
Monolithic Integration .. 37
Hybrid Integration .. 38
Module Integration .. 40
Differentiation of Integration Methods .. 42
Chapter 6: Market Breakdown by Type of Raw Material .. 44
Indium Phosphide .. 46
Gallium Arsenide .. 49
Lithium Niobate .. 51
Silica-on-Silicon .. 54
Silicon .. 57
Others (Silicon Dioxide, Silicon Nitride, SOI, Ge, SiGe) .. 60
Chapter 7: Market Breakdown by Type of Application .. 65
Optical Communications .. 67
Sensing .. 70
Biophotonics .. 73
Optical Signal Processing .. 76
Chapter 8: Market Breakdown by Region .. 81
North America .. 82
Europe .. 86
Asia-Pacific (APAC) .. 90
Rest of the World (RoW) .. 94
Global Issues in the Development of PICs .. 97
Chapter 9: Patent Review .. 99
Significant Patents .. 99
Silicon Photonic Heater-Modulator..99
Optical Fiber for Silicon Photonics ..99
III-V Photonic Crystal Microlaser Bonded on Silicon-on-Insulator ..99
Redundant Light Supply for Silicon Photonic Chip ..100
Silicon Photonics Integration Method and Structure ..100
Silicon Photonics Device and Communication System ..100
Photonic Flexible Interconnect .. 101
Integrated Control Module for Communication System on a Chip for Silicon Photonics .. 101
Coupling Optical Signals into Silicon Optoelectronic Chips .. 102
Photonic Integrated Circuit (PIC) and Silicon Photonics (SIP) Circuitry Device ..102
Patent Review by Year .. 103
Patent Review by Region ..103
Chapter 10: Market Share Analysis ..106
Chapter 11: Company Profiles ..108
Appendix: Factors Impacting Growth ..130
Influential Factors ..130
Forecast Factors ..130
Other Factors ..130
Supplier Influence .. 131
Buyer Influence .. 131
About BCC Research .. 132
About BCC Research.. 133
BCC Membership .. 133
BCC Custom Research .. 133
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