Thin-layer Deposition: CVD, Ion Implantation and Epitaxy
Publish Date: May 2019 | Category: Electronics & Semiconductor | Publisher: BCC Research | Status: Publish
The global market for thin-layer deposition technologies should grow from $32.1 billion in 2017 to $60.7 billion by 2022 at a compound annual growth rate (CAGR) of 13.6% for the period of 2017-2022.
The scope of the study is limited to the three main technologies as named in the Thin-layer deposition market. Also, this report studies and discusses the materials of these technologies, in terms of applications and properties. BCC Research analyzes the major types of CVD, ion implantation and epitaxy systems used to manufacture products in four key industries. The report assesses and reviews trends in demand and their impact on each Thin-film technology and key market drivers within each industry.
- 42 data tables and 36 additional tables - An overview of the global market for thin-layer deposition technologies within the semiconductor manufacturing industry - Analyses of global market trends with data from 2016, 2017, and projections of compound annual growth rates (CAGRs) through 2022 - Information on major types of deposition technologies, their applications and unique properties by three types of materials -- chemical vapor deposition (CVD), ion implantation and molecular beam epitaxy (MBE) systems - Analysis of the industry’s manufacturing capacity and consumption by various regional markets covering Americas, EMEA and APAC - Discussion on the influence of government regulations, technological updates, and the economic factors that affect the growth of the market - Company profiles of the leading market players within the industry including Applied Materials Inc., CVD Equipment Corp., LAM Research Corp., SUMCO Corp., and Tokyo Electron Ltd.
The global Thin-filmdeposition market operates in a highly robust technological environment that yields both opportunities and challenges. Vendors are responding to the changing environment by innovating and delivering differentiated and high-quality solutions. The market continues to demonstrate strong growth, reaching double-digit growth in the forecasted period. The overall market reached REDACTED in 2017, up REDACTED from 2016, and is expected to total REDACTED by 2022. CVD remains the largest technology, capturing almost two-thirds of the global market. By 2022, the share of ion implantation will reach REDACTED and CVD will shrink to REDACTED. Molecular beam epitaxy will continue to retain a small share of the global Thin-layerdeposition market.
Thin-film deposition is an integral part of every industry in today’s world. The primary objective of Thinlayer deposition is to impart desirable physical characteristics onto an object so that the object is suited for the required purpose. Almost all microelectronic products require some form of Thin-layer deposition or the other to preserve their longevity.
Microelectronics is one of the largest End-user industries for Thin-layer deposition. It covers a broad range of products, ranging from semiconductors to flat-panel displays. Decades ago, because flat-panel displays were in their early growth stages, the products not contribute much in the way of technological advances to the microelectronics industry. Today, though, flat-panel displays form an integral part of any industry, contributing much in terms of volume as well as revenue to the microelectronics industry. Industries such as cutting tools, industrial and medical have impacted the demand for Thin-layer deposition. Each industry continues to register advances in technology that require more complex materials. This requires the Thin-layer deposition industry to continually evolve to remain in lockstep with them.
Table of Contents
Chapter 1 Introduction Study Goals and Objectives Reasons for Doing This Study Scope of Report Information Sources Methodology Geographic Breakdown Analyst's Credentials BCC Custom Research Related BCC Research Reports
Chapter 2 Summary and Highlights Thin-film Industry Changes Technology Expansion in the Asia-Pacific Region
Chapter 3 Market and Technology Background Deposition Technologies End-user Industries Microelectronics Medical Industrial Tooling Key Market Drivers Fast-Growing Semiconductor Market Tremendous Number of Existing and Emerging Market Applications Intensive R&D by Universities, Institutes and Industrial End-users Key Market Challenges Huge Capital Investment Ongoing R&D Requirement Compliance, Restrictions and Regulatory Pressures
Chapter 4 Market Breakdown by Technology Chemical Vapor Deposition Basic Thermal Chemical Vapor Deposition Metal-organic Chemical Vapor Deposition Atmospheric Pressure Chemical Vapor Deposition Low-pressure Chemical Vapor Deposition Plasma-enhanced Chemical Vapor Deposition High-density Plasma Chemical Vapor Deposition Tetra-ethoxysilane Ozone Chemistry Ion-implantation Technology Beamline Ion Implantation Plasma-immersion Ion Implantation Ion-assisted Deposition Ion Beam-assisted Deposition Epitaxy Molecular Beam Epitaxy
Chapter 5 Market Breakdown by End-user Industry Microelectronics Semiconductor Applications of CVD Semiconductor Applications of Ion Implantation Epitaxy Applications for Semiconductors Components Flat-Panel Displays Light-Emitting Diodes Medical Industry Medical Products Industrial Product Definition Technology Aerospace Market Industrial Thin-film Applications Industrial CVD and Ion-implantation Market Growth Factors Tooling Product Definition Cutting Tool Industry Competitiveness New Product Development International Market Growth Technology Cutting Tool Growth Factors Cutting Tool Applications CVD Reactor Types CVD versus PVD Process Industry Competitiveness of Thin-film Processes in Microelectronics Economic Conditions in Microelectronics
Chapter 6 Market Breakdown by Material Chemical Vapor Deposition Materials Ion-implantation Materials Molecular Beam Epitaxy Materials
Chapter 7 Market Breakdown by Region Americas EMEA Asia-Pacific
Chapter 8 Patent Review/New Developments Chemical Vapor Deposition-related Patents Ion Implantation-related Patents Molecular Beam Epitaxy-related Patents Chapter 9 Analysis of Market Opportunities Next Generation Applications Gradual Replacement of Si by GaN and SiC Demand for Impenetrable, High Purity, Homogeneous Coating Surface Materials Emerging Opportunities for Thin-film Technology
Chapter 10 Company Profiles ADVANCED MICRO FABRICATION EQUIPMENT AIXTRON SE APPLIED MATERICALS INC. CVD EQUIPMENT CORP. IHI HAUZER B.V. IHI IONBOND KOKU.S.AI SEMICONDUCTOR EQUIPMENT CORP. LAM RESEARCH CORP. OERLIKON BALZERS SHIN-ETSU CHEMICAL CO. LTD. SUMCO CORP. TOKYO ELECTRON LTD. VEECO INSTRUMENTS INC. Chapter 11 Acronyms