Thin-layer Deposition: CVD, Ion Implantation and Epitaxy

Publish Date: May 2019 | Category: Electronics & Semiconductor | Publisher: BCC Research | Status: Publish

The global market for thin-layer deposition technologies should grow from $32.1 billion in 2017 to $60.7 billion by 2022 at a compound annual growth rate (CAGR) of 13.6% for the period of 2017-2022.

Report Scope:

The scope of the study is limited to the three main technologies as named in the Thin-layer deposition market. Also, this report studies and discusses the materials of these technologies, in terms of applications and properties. BCC Research analyzes the major types of CVD, ion implantation and epitaxy systems used to manufacture products in four key industries. The report assesses and reviews trends in demand and their impact on each Thin-film technology and key market drivers within each industry.

Report Includes:

- 42 data tables and 36 additional tables
- An overview of the global market for thin-layer deposition technologies within the semiconductor manufacturing industry
- Analyses of global market trends with data from 2016, 2017, and projections of compound annual growth rates (CAGRs) through 2022
- Information on major types of deposition technologies, their applications and unique properties by three types of materials -- chemical vapor deposition (CVD), ion implantation and molecular beam epitaxy (MBE) systems
- Analysis of the industry’s manufacturing capacity and consumption by various regional markets covering Americas, EMEA and APAC
- Discussion on the influence of government regulations, technological updates, and the economic factors that affect the growth of the market
- Company profiles of the leading market players within the industry including Applied Materials Inc., CVD Equipment Corp., LAM Research Corp., SUMCO Corp., and Tokyo Electron Ltd.

Summary

The global Thin-filmdeposition market operates in a highly robust technological environment that yields both opportunities and challenges. Vendors are responding to the changing environment by innovating and delivering differentiated and high-quality solutions. The market continues to demonstrate strong growth, reaching double-digit growth in the forecasted period. The overall market reached REDACTED in 2017, up REDACTED from 2016, and is expected to total REDACTED by 2022. CVD remains the largest technology, capturing almost two-thirds of the global market. By 2022, the share of ion implantation will reach REDACTED and CVD will shrink to REDACTED. Molecular beam epitaxy will continue to retain a small share of the global Thin-layerdeposition market.

Thin-film deposition is an integral part of every industry in today’s world. The primary objective of Thinlayer deposition is to impart desirable physical characteristics onto an object so that the object is suited for the required purpose. Almost all microelectronic products require some form of Thin-layer deposition or the other to preserve their longevity.

Microelectronics is one of the largest End-user industries for Thin-layer deposition. It covers a broad range of products, ranging from semiconductors to flat-panel displays. Decades ago, because flat-panel displays were in their early growth stages, the products not contribute much in the way of technological advances to the microelectronics industry. Today, though, flat-panel displays form an integral part of any industry, contributing much in terms of volume as well as revenue to the microelectronics industry. Industries such as cutting tools, industrial and medical have impacted the demand for Thin-layer deposition. Each industry continues to register advances in technology that require more complex
materials. This requires the Thin-layer deposition industry to continually evolve to remain in lockstep with them.

Table of Contents

Chapter 1 Introduction
Study Goals and Objectives
Reasons for Doing This Study
Scope of Report
Information Sources
Methodology
Geographic Breakdown
Analyst's Credentials
BCC Custom Research
Related BCC Research Reports

Chapter 2 Summary and Highlights
Thin-film Industry Changes
Technology Expansion in the Asia-Pacific Region

Chapter 3 Market and Technology Background
Deposition Technologies
End-user Industries
Microelectronics
Medical
Industrial
Tooling
Key Market Drivers
Fast-Growing Semiconductor Market
Tremendous Number of Existing and Emerging Market Applications
Intensive R&D by Universities, Institutes and Industrial End-users
Key Market Challenges
Huge Capital Investment
Ongoing R&D Requirement
Compliance, Restrictions and Regulatory Pressures

Chapter 4 Market Breakdown by Technology
Chemical Vapor Deposition
Basic Thermal Chemical Vapor Deposition
Metal-organic Chemical Vapor Deposition
Atmospheric Pressure Chemical Vapor Deposition
Low-pressure Chemical Vapor Deposition
Plasma-enhanced Chemical Vapor Deposition
High-density Plasma Chemical Vapor Deposition
Tetra-ethoxysilane Ozone Chemistry
Ion-implantation Technology
Beamline Ion Implantation
Plasma-immersion Ion Implantation
Ion-assisted Deposition
Ion Beam-assisted Deposition
Epitaxy
Molecular Beam Epitaxy

Chapter 5 Market Breakdown by End-user Industry
Microelectronics
Semiconductor Applications of CVD
Semiconductor Applications of Ion Implantation
Epitaxy Applications for Semiconductors
Components
Flat-Panel Displays
Light-Emitting Diodes
Medical Industry
Medical Products
Industrial
Product Definition
Technology
Aerospace Market
Industrial Thin-film Applications
Industrial CVD and Ion-implantation Market Growth Factors
Tooling
Product Definition
Cutting Tool Industry Competitiveness
New Product Development
International Market Growth
Technology
Cutting Tool Growth Factors
Cutting Tool Applications
CVD Reactor Types
CVD versus PVD Process
Industry Competitiveness of Thin-film Processes in Microelectronics
Economic Conditions in Microelectronics

Chapter 6 Market Breakdown by Material
Chemical Vapor Deposition Materials
Ion-implantation Materials
Molecular Beam Epitaxy Materials

Chapter 7 Market Breakdown by Region
Americas
EMEA
Asia-Pacific

Chapter 8 Patent Review/New Developments
Chemical Vapor Deposition-related Patents
Ion Implantation-related Patents
Molecular Beam Epitaxy-related Patents
Chapter 9 Analysis of Market Opportunities
Next Generation Applications
Gradual Replacement of Si by GaN and SiC
Demand for Impenetrable, High Purity, Homogeneous Coating Surface Materials
Emerging Opportunities for Thin-film Technology

Chapter 10 Company Profiles
ADVANCED MICRO FABRICATION EQUIPMENT
AIXTRON SE
APPLIED MATERICALS INC.
CVD EQUIPMENT CORP.
IHI HAUZER B.V.
IHI IONBOND
KOKU.S.AI SEMICONDUCTOR EQUIPMENT CORP.
LAM RESEARCH CORP.
OERLIKON BALZERS
SHIN-ETSU CHEMICAL CO. LTD.
SUMCO CORP.
TOKYO ELECTRON LTD.
VEECO INSTRUMENTS INC.
Chapter 11 Acronyms

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